Saturday - November 23, 2024
CHIPS for America Announces up to $300 million in Funding to Boost U.S. Semiconductor Packaging
November 21, 2024
WASHINGTON, Nov. 21 -- The U.S. Department of Commerce issued the following news release:

Projects in Georgia, California, and Arizona aim to strengthen America's leadership in cutting-edge substrate technology for critical industries like AI

Today, the Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accele . . .

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