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TSMC and Cadence Collaborate to Deliver AI-Driven Advanced-Node Design Flows, Silicon-Proven IP and 3D-IC Solutions
September 26, 2024
SAN JOSE, California, Sept. 26 -- Cadence Design Systems, a provider of electronic design automation and semiconductor intellectual property, issued the following news release on Sept. 25, 2024:

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Highlights:

* AI-driven digital and custom design flows available for the latest TSMC N2P and N3 technologies

* Cadence is collaborating with TSMC on A16 design solutions to optimize PPA

* Cadence Integrity 3D-IC Platform unifying pac . . .

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