TSMC Expands Collaboration With Ansys by Integrating AI Technology to Accelerate 3D-IC Design
September 26, 2024
September 26, 2024
PITTSBURGH, Pennsylvania, Sept. 26 -- Ansys, a computer-aided engineering software developer, issued the following news release:
* * *
Ansys AI technology improves 3D-IC design productivity, while the broader collaboration advances innovative 3D-IC thermal, mechanical stress, and photonic solutions for AI, HPC, and high-speed data communication semiconductors
* * *
Key Highlights
* Ansys artificial intelligence (AI)-driven solution . . .
* * *
Ansys AI technology improves 3D-IC design productivity, while the broader collaboration advances innovative 3D-IC thermal, mechanical stress, and photonic solutions for AI, HPC, and high-speed data communication semiconductors
* * *
Key Highlights
* Ansys artificial intelligence (AI)-driven solution . . .