DARPA Brings Next-Gen US Microelectronics Manufacturing Closer to Reality
July 19, 2024
July 19, 2024
WASHINGTON, July 19 (TNSres) -- The U.S. Department of Defense's Defense Advanced Research Projects Agency issued the following news:
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New Agreement To Establish Domestic 3DHI Production Capability
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The Next-Generation Microelectronics Manufacturing program, known as NGMM, aims to unlock accessible prototyping for the chips of tomorrow with a new agreement to establish the first-ever national center for advancing U.S.-based microelect . . .
* * *
New Agreement To Establish Domestic 3DHI Production Capability
* * *
The Next-Generation Microelectronics Manufacturing program, known as NGMM, aims to unlock accessible prototyping for the chips of tomorrow with a new agreement to establish the first-ever national center for advancing U.S.-based microelect . . .