Q&A: How can advanced chip packaging help redesign the future of semiconductors?
May 07, 2024
May 07, 2024
UNIVERSITY PARK, Pennsylvania, May 7 -- Pennsylvania State University issued the following news:
The phrase "advanced chip packaging" might conjure images of a fancy Pringles can. For those who manufacture semiconductors -- also known as integrated circuits, chips or microchips -- it represents a new frontier, a race to design and mass produce the next generation of semiconductors that use less energy while delivering more computing power.
Traditionally comple . . .
The phrase "advanced chip packaging" might conjure images of a fancy Pringles can. For those who manufacture semiconductors -- also known as integrated circuits, chips or microchips -- it represents a new frontier, a race to design and mass produce the next generation of semiconductors that use less energy while delivering more computing power.
Traditionally comple . . .