SEMI: Semiconductor Industry Experts to Present Solutions to Boost Performance at Advanced Packaging Summit in Korea
August 21, 2024
August 21, 2024
SAN JOSE, California, Aug. 21 -- SEMI, an association serving the manufacturing supply chain for the electronics industry, issued the following news release:
With innovations in advanced packaging crucial to enhancing semiconductors for AI, high-performance computing (HPC) and other leading-edge applications, the Advanced Packaging Summit 2024 will gather industry visionaries on September 11 at the Suwon Convention Center to present packaging technology roadmaps and discuss solution . . .
With innovations in advanced packaging crucial to enhancing semiconductors for AI, high-performance computing (HPC) and other leading-edge applications, the Advanced Packaging Summit 2024 will gather industry visionaries on September 11 at the Suwon Convention Center to present packaging technology roadmaps and discuss solution . . .